Crimping solutions for Data Connectivity will play an important role in the future of connected vehicles, but these tooling products bring with them new technical challenges — such as the need to crimp multiple times to get a final product. Join TE Connectivity for an exclusive webinar, during which our experts will focus on these […]
Bottom termination components (BTCs) are becoming increasingly common in assemblies due to their low cost and high performance. There are varying types of BTCs in the electronics industry, such as QFN, SOIC, and LGA, all of which are typical on assemblies. The defining characteristic of these components is that the terminations are flat on the […]
This webinar will review the how’s, why’s, and important aspects of publishing technical papers and presentations at conferences. Described will be advanced preparations, prior to submitting an abstract or paper, that should be considered by the author and their management. The mechanics, format, and examples of writing an effective and high-quality technical paper and presentation […]
In the face of numerous challenges, the global economy has demonstrated remarkable resilience this year, notably in the United States, where it has surpassed many anticipations. The ongoing efforts of central banks to curb inflation have cast a shadow of uncertainty over economic activities in the back half of the year. The global growth landscape […]
This webinar will provide an overview of the new one-time EPA reporting rule on PFAS under the Toxic Substances Control Act. The new rule will have a significant impact on electronics producers and importers, because of (a) the widespread use of PFAS within the electronics supply chain; (b) the very expansive definition of PFAS in […]
This webinar is designed to provide non-professional cybersecurity specialists with the facts and awareness they need. No extensive knowledge of cybersecurity is required. Topics include: • The possibility you may be the target of a cyber attack. • Why attack countermeasures and manufacturing members of the production floor seem so far away. • The efforts […]
Electronics manufacturers aim to minimize the amount of flux residues. Solder flux residues constitute a significant source of ionic contamination on the manufactured PCBAs, and the activator type in the flux determines their corrosiveness. The risk occurs on low standoff components, such as the QFN, due to blocked flux outgassing channels. The second risk is […]
In today's rapidly changing electronics manufacturing landscape, staying competitive and adaptable is essential. Our training course topics include ESD, Safety, Electronics Assembly for Operators, Electronics Assembly for Engineers, Cable and Wire Harness Assembly, and a Manufacturing Engineer series. We'll show you how to implement these courses to address current training challenges in the industry such […]
Implementation of a new process, machine, or material triggers a qualification event for that change under the new H revision of IPC J-STD-001. When a change in specific materials is being considered, one must determine and provide objective evidence that the improvement does not increase the quality or functionality risk of the product. In order […]
A group of industry experts will discuss the evidence of the root causes of creep corrosion, relevant testing, and effective mitigation strategies available to prevent creep corrosion failures in electronics. Fundamentally, creep corrosion is the product of the reaction of copper with sulfur, which may be mitigated with manufacturing processes, such as the printed circuit […]