Engineering Webinar – CCA SMT Cleaning Processes and Solder-Flux Effects For Mil/Aero Applications
DfR- DESIGN for Rinse-Ability: The Effect of SMT Component Package Design on Cleaning Circuit Card Assemblies (CCA) manufactured using Surface Mount Technology SMT processes have exhibited cleaning residues remaining after subsequent conformal coating required for Mil/Aero product within electronic component/package housings with degradation/corrosion of internal parts that may detrimentally affect the electrical performance of the components. […]