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Inspection and Failure Analysis of Bottom Termination Components
Inspection and Failure Analysis of Bottom Termination Components
Bottom termination components (BTCs) are becoming increasingly common in assemblies due to their low cost and high performance. There are varying types of BTCs in the electronics industry, such as QFN, SOIC, and LGA, all of which are typical on assemblies. The defining characteristic of these components is that the terminations are flat on the […]