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Test Methods to Validate Acceptable Levels of Flux and Other Process Residues on Production Assemblies
Test Methods to Validate Acceptable Levels of Flux and Other Process Residues on Production Assemblies
Electronics manufacturers aim to minimize the amount of flux residues. Solder flux residues constitute a significant source of ionic contamination on the manufactured PCBAs, and the activator type in the flux determines their corrosiveness. The risk occurs on low standoff components, such as the QFN, due to blocked flux outgassing channels. The second risk is […]
